Photolithography and mask alignment

For photolithografic patterning of metal, semiconductor or insulator layers like Al, Al/1.5%Si, Au, Cr, Ta, a-Si, a-Ge, SiO2, Si3N4, ... the following equipment is available:

Mask-Aligner MA4 (SÜSS Microtech)

Substrates

up to 100 mm subtrates
Application one- and two-sided photolithographic patterning of metal, semiconductor or insulator films on semiconductor and glass substrates
Mask-Aligner MA6 (SÜSS Microtech)
Substrates up to 150 mm substrates
Application like MA4
Spin-Coater GYRSET RC 518 (SÜSS)
Substrates up to 100 mm substrates
Application spin coating of wafers with photoresists (usually S1805 and S1813)
Spin-Coater APT Polos (SPS Europe B.V.)
Substrates up to 150 mm subtrates
Application like GYRSET RC 518

XY-dimensions and accuracy of patterned layers can be controlled and measured by optical microscopy combined with a CCD camera and the interactive measuring unit MFK II.