Process Technology and Devices

Nanoparkwafer_ausschnittThe Division of Process Technology performs semiconductor preparation processes for silicon and other semiconductor materials, like GaAs, SiC and diamond. The activities comprise the pre- and after-ion-beam sample processing, the fabrication of test structures and devices for different analytical and electrical investigations as well as industrial customer based semiconductor process and device developments.

The semiconductor wafer processing is mainly focused on the research topics Nanostructures, Optoelectronic Materials and Doping & Defects in Semiconductors of the Institute of Ion Beam Physics and Materials Research.

The preparation equipment in the Class-100 cleanroom incorporates:

  • Processing Technologies
    • Wet chemical wafer cleaning and isotropic thin layer etching
    • Wet chemical anisotropic and selective silicon bulk etching
    • Photolithography and mask alignment (double sided)
    • ICP reactive ion etching based on fluorine gases
    • Furnace thermal oxidation, diffusion and annealing
    • Rapid thermal processing (annealing and oxidation)
    • High Temperature vacuum annealing
  • Thin Film Deposition
    • Sputtering (DC, RF and magnetron, various materials)
    • Evaporation (e-beam, resistive, various materials)
  • Fine-focused Ion Beam (FIB)
    • Direct patterning on µm- and nm-scale
    • Local and writing ion implantation
    • FIB-assisted layer deposition and etching
    • Development and analysis of liquid metal alloy ion sources
  • Device Packaging
    • Ultrasonic wire bonding
    • Epoxy encapsulation
  • Measurement and Characterization
    • Optical layer thickness measurement (interferometric, ellipsometric)
    • Optical line width measurement
    • Optical microscopy
    • Surface profiling and roughness measurement
    • Atomic force microscopy (AFM)
    • Electrical measuring techniques (I/V-, MIS-C/V-measurement)
  • Computer Aided Design
    • Mask layout design for photolithography (AUTOCAD)


PD Dr. habil. Artur Erbe
Scaling Phenomena
Phone: +49 351 260 2366