Publications Repository - Helmholtz-Zentrum Dresden-Rossendorf

Copper electrodeposition on a conically shaped copper or iron electrode was studied under the influence of a vertical magnetic field. Numerical simulations were conducted to provide understanding of the interaction between the magnetic forces and the buoyancy force involved in the deposition process. The secondary flow caused by the Lorentz force is directed downward towards the cone, which is counteracted by the buoyancy force as the cathode is placed at the bottom of the electrochemical cell. For the iron cone, the magnetic gradient force can perceptibly enhance the local downward flow and is thus supporting conical growth, which indicates potential benefits of using magnetic fields in electrodeposition processes.