Contact

Prof. Dr. Artur Erbe

Head Nanoelectronics
a.erbeAthzdr.de
Phone: +49 351 260 2366

Dr. Yordan Georgiev

Head Nanofabrication and Analysis
Head of Nanofabrication
y.georgiev@hzdr.de
Phone: +49 351 260 2321

Dr. Matthias Krause

Head Nanomaterials and Transport
matthias.krauseAthzdr.de
Phone: +49 351 260 3578

Instrumental equipment and devices

Electron beam lithogaphy

Machine Details
RAITH 150
Electron beam writer
RAITH 150 TWO
  • Manufacturer: RAITH GmbH
  • Applications:
    • Nanolithography
    • Imaging
  • Electron source:
    • 30 kV Schottky thermal field electron emitter ZrO/W
  • Sample size: ≤ 4 inch wafer
  • Smallest feature size: sub 8 nm
  • Sample stage with laser interferrometer
    • Resolution: 1nm
  • Height sensing and FBMS mode available
  • GDSII editor for generation of complex structure design on several layers with individual dose factor assignment for single structrure elements
  • NanoPECSTM software suite for the correction of proximitty effects

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

RAITH eLiNE
Electron beam writer
RAITH eLiNE plus
  • Manufacturer: RAITH GmbH
  • Applications:
    • Nanolithography
    • Imaging
    • Nanoengineering
  • Electron source:
    • 30 kV Schottky thermal field electron emitter ZrO/W
  • Sample size: ≤ 3 inch wafer
  • Smallest feature size: sub 5 nm
  • Sample stage with laser interferrometer
    • Resolution: 1nm
  • 4 integrated nanomanipulators for e.g. nanoprobing
  • Height sensing mode available
  • GDSII editor for generation of complex structure design on several layers with individual dose factor assignment for single structrure elements
  • NanoPECSTM software suite for the correction of proximitty effects

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Deposition and annealing

BETty
UHV evaporation tool
BETty
  • Manufacturer: BESTEC GmbH
  • Base pressure <10-9 mbar
  • E-gun evaporator (7 pockets)
  • Thermal evaporator (Al)
  • Temperature range 130 K – 600 K
  • Tilt range ±45°
  • Sputter gun (sample cleaning)
  • Application: Metal film deposition

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

LAB500
Evaporation tool
LAB500
  • Manufacturer: Leybold Optics
  • Base pressure <10-7 mbar
  • Substrate diameter: max. 100 mm
  • Substrate thickness: max. 25 mm
  • E-gun evaporator (4 pockets)
  • Thermal evaporator (2 sources)
  • Application: Metal film deposition

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

ALD
Atomic layer deposition
  • Manufacturer: Ultratech/CambridgeNanotechALD
  • Substrate size: ≤ 4 inch wafer
  • Temperature: 80 - 350°C
  • Materials:
    • Al2O3
    • HfO2
    • SiO2
    • mixed layers (on request)

Responsible: Dr. L. Rebohle, l.rebohle@hzdr.de, 0351 / 260 - 3368, Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Sputter Coater
Sputter Coater
Desk V
  • Manufacturer: Denton Vacuum
  • Substrate: ≤ 2 inch wafer
  • Material: Au

    Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

RTA
Rapid thermal annealing
JetFirst 100
  • Manufacturer: Jipelec
  • Substrate size: ≤. 4 inch wafer
  • Temperature: ≤ 1300°C
  • Gases: Ar, N2

Responsible: Dr. S. Winnerl, s.winnerl@hzdr.de, 0351 / 260 - 3522, Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

High vacuum oven
High vacuum oven
XERION X-TUBE
  • Manufacturer: XERION ADVANCED HEATING® Ofentechnik GmbH
  • Sample size: ≤ 4 inch wafer
  • Temperature range: ≤ 800°C
  • Pressure: down to 4*10-7 mbar
  • Gas: N2
  • Ramp rates for heating up and cooling down

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Etching and cleaning

RIBE IonSys 500
Reactive ion beam etcher
IonSys 500
  • Manufacturer: ROTH & RAU AG
  • Applications:
    • Non-selective etching by sputtering with Ar gas
    • Anisotropic etching of:
      • Metals
      • Magnetic stacks
      • SiO2
  • Sample size: ≤ 6 inch wafer
  • Ar source
  • Etch gas: CF4
  • Helium backside cooling
  • Sample tilting: ≤ 90°
  • Sample rotation: ≤ 10 rpm
  • Secondary Ion Mass Spectrometer (SIMS) manufactured by Hiden Analytical, UK for end point detection

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Plasma cleaner
Plasma cleaner
PICO
  • Manufacturer: DIENER ELECTRONIC GmbH + Co. KG
  • Applications:
    • Activating of semiconductors
    • Cleaning of semiconductors
    • Etching of semiconductors
    • Plasmapolymerisation
  • Sample size: ≤ 4 inch wafer
  • Gases: O2, Ar
  • , N2
  • Frequency: 2,45 GHz
  • Power: 0 - 300W
  • Faraday box for electrical sensitive components
  • Piranisensor is measuring the pressure below 10 mbar
  • Power display of the generator
  • Timer for setting the process time up to 999,9 min

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Electrical characterisation

Cryogenic probe station CPX-VF
Cryogenic probe station
CPX-VF
 
  • Manufacturer: LAKESHORE
  • Applications:
    • C-V measurements
    • I-V measurements
    • 4-Probe measurements
    • Hall measurements
    • Microwave measurements
    • Electro-optical measurements
    • all measurements can be combined with out-of-plane vertical field superconducting magnetic measurements
  • Sample size: ≤ 2 inch wafer
  • Magnetic field: ∓ 2,5 T
  • Orientation of the magnetic field: vertical out-of-plane
  • Temperature range: 4.5 K – 400 K
  • Available sample holder:
    • grounded sample holder
    • coaxial sample holder
    • tiltable sample holder
      • Orientation of the magnetic field can be changed to in-plane
  • Measuring instruments:
    • AGILENT 4156C Precision Semiconductor Parameter Analyzer
    • LakeShore 625 Superconductiong magnet power supply
    • LakeShore 340 Temperature controller
    • LakeShore 332 Temperature controller
  • Incoupling of a laser signal (λ = 473nm / 785nm) possible
  • Multiple radiation shields for best low temperature performance
  • Minimize sample condensation during cool-down
  • True 90° probing

Responsible: Dr. A. Erbe, a.erbe@hzdr.de, 0351 / 260 - 2366>

Cryogenic probe station TTP-4A
Cryogenic probe station
TTP-4A
  • Manufacturer: LAKESHORE
  • Applications:
    • C-V measurements
    • I-V measurements
    • Microwave measurements
    • Electro-optical measurements
  • Sample size: ≤ 2 inch wafer
  • Temperature range: 4.5 K – 400 K
  • Available sample holder:
    • grounded sample holder
    • coaxial sample holder
  • Measuring instruments:
    • AGILENT 4156C Precision Semiconductor Parameter Analyzer
    • AGILENT 34410A Digital Multimeter
    • KEITHLEY 2400 Source Meter
    • LakeShore 332 Temperature controller
  • Incoupling of a laser signal (λ = 473nm / 785nm) possible
  • Radiation shield for best low temperature performance
  • Minimize sample condensation during cool-down
  • True 90° probing

Responsible: Dr. A. Erbe, a.erbe@hzdr.de, 0351 / 260 - 2366>

MCBJ
Mechanically controlled
break junction setup
  • Applications:
    • Electrical characterization of molecular structures
      • at room temperature
      • in liquid environment
  • Currently investigated molecules:
    • Selenium metal complexes
    • Polythiophenes
    • Bucky-bowl structures (e.g. Corannulene)
  • Currently investigated solvents:
    • Mesitylen
    • Toluol
  • Current measurement in the range of Femto-Ampere due to electrical and magnetic shielding technology
  • 4 setups

Responsible: Dr. A. Erbe, a.erbe@hzdr.de, 0351 / 260 - 2366

Cryogenic UHV break junction setup
Cryogenic UHV
break junction setup
  • Applications:
    • I-V measurements
    • Ploting histograms of the conductance
    • Inelastic electron tunneling spectroscopy (IETS)
    • Point-contact spectroscopy (PCS)
  • Temperature range: 5 K – 300 K
    • Accuracy: 0,1 K
  • Pressure (at low temperatures): 5*10-5 mbar
  • In situ deposition of molecules into the break junctions
    • Via thermal evaporation of e.g. C60
      • Depostion rate: 0,2 Å/s - 0,6 Å/s
      • Thicknesses of ¼ up to 1 monolayer
  • Measuring instruments:
    • KEITHLEY 2400 Source Meter
    • KEITHLEY 6430 Sub Femtoamp Remote Source Meter
    • LakeShore 331 Temperature controller
    • YOKOGAWA 7651 Programmable DC Source

Responsible: Dr. A. Erbe, a.erbe@hzdr.de, 0351 / 260 - 2366

Optical characterisation

Optical tweezers
Optical tweezers
  • tool for ...
    • ...
  • Application: ...

Responsible: ...

Sample preparation and lab equipment

Laser cutter
Laser cutter
skylaser MARK 20
  • Manufacturer: PFEIFER technology & innovation
  • Applications:
    • Surface graving and labeling
    • Cutting of wood, plastics, (to some extend) Silicon
  • Sample size: up to 110 x 110 cm²
  • Alignment accuracy: ~ 0,1mm
  • Laser power: 20 W
  • Laser source: Ytterbium pulsed fiber laser
  • Wavelength: 1064nm
  • Speed: max. 10.000 mm/s
  • Frequency: 20 - 80kHz

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

SpinCoater LabSpin6
Spin Coater
LabSpin 6
  • Manufacturer: SÜSS MicroTec
  • Applications:
    • Spin coat resists for electron beam lithography
  • Sample size: ≤ 4 inch wafer
  • Rotation speed: ≤ 8000 rpm

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

SpinCoater Spin150i
Spin Coater
POLOS Spin150i
  • Manufacturer: SPS Europe
  • Applications:
    • Spin coat HSQ resist
  • Sample size: ≤ 4 inch wafer
  • Rotation speed: ≤ 12.000 rpm

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Hotplate HP-20D
Hotplate
HP-20D
  • Manufacturer: witeg Labortechnik GmbH
  • Applications:
    • Pre/Post bake of EBL resist
    • Sample cleaning
    • Lift off processes
  • Sample size: 180 mm x 180 mm
  • Temperature: ≤ 380°C

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Hotplate VelpScientifica
Hotplate
Velp Scientifica
  • Manufacturer: VelpScientifica
  • Applications:
    • Pre/Post bake of EBL resist
    • Sample cleaning
    • Lift off processes
  • Sample size: 180 mm x 180 mm
  • Temperature: ≤ 550°C

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Optical microscope
Optical microscope
OPLYMPUS BX51
  • Manufacturer: OLYMPUS GmbH
  • Magnifications: 5x, 10x, 20x, 50x, 100x, 250x
  • Dark field and bright field mode
  • Transmitted light and reflected light mode
  • Taking images with the installed camera (Carl Zeiss Axio Cam MRc)

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Ultrasonic bath
Ultrasonic bath
USC 300D
  • Manufacturer: VWR
  • Ultrasonic frequency: 45 kHz
  • Ultrasound power: 32 - 80 W (9 power levels)
  • Temperatur: ≤ 80°C
  • Time: ≤ 99 min
  • Degas function

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Orbital shaker
Multi-functional orbital shaker
PSU-20i
  • Manufacturer: bioSan
  • Orbital rotation:
    • Speed control range: 20 -250 rpm
    • Increment: 5 rpm
    • Time setting range: ≤ 250 s per cycle
  • Reciprocal motion:
    • Amplitude range: 0 - 360°
    • Increment: 30°
    • Time setting range: ≤ 250 s per cycle
  • Vibro motion:
    • Amplitude range: 0 - 5°
    • Increment: 1°
    • Time setting range: ≤ 5 s per cycle
  • Load: max 8 kg (below 150 rpm)

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

High precision scale
High precision scale
ABJ120
  • Manufacturer: Kern
  • Max. weight: 120 g
  • Min. weight: 10 mg
  • Readability: 0,1 mg

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Fume hood
Fume hood
Secuflow
  • Manufacturer: Waldner
  • Volume flow: at least 330 m³/h

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Flowbox
Laminar flowbox
  • Manufacturer: BDK Luft- und Reinraumtechnik GmbH
  • Filter class: H14

Responsible: Dr. Y. Georgiev, Y.Georgiev@hzdr.de, 0351 / 260 - 2321

Planned experimental setups

ASOPS
Asynchronous Optical Sampling (ASOPS)
  • Application
    • Optical characterization of nanomechanical resonators

Responsible: Dr. A. Erbe, a.erbe@hzdr.de, 0351 / 260 - 2366

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