Package Labelling with Printed Metal-Particle Suspensions using Millisecond Thermal Processing


Package Labelling with Printed Metal-Particle Suspensions using Millisecond Thermal Processing

Wiesenhütter, K.; Schumann, T.; Zichner, R.; Gebel, T.; Wiesenhütter, U.; Richter, H. U.; Skorupa, W.

The need for novel, flexible and low-cost electronic products with functionality far beyond that offered by conventional size-restricted and rigid semiconductor devices requires a rapid development of advanced material and deposition technology concepts. One of the most promising pathways to realize this ambitious goal is printed flexible electronics (PFE). Recently, printing has successfully demonstrated its potential for manufacture of advanced low-cost electronic products such as flexible displays, thin-film solar cells, large-area sensors etc. Importantly, by using bendable, inexpensive media (e.g.: paper-like substrates, polymer films) and high-throughput roll-to-roll (R2R) processing, a significant reduction of the overall costs associated with electronic device fabrication has been achieved.
Here, we report on a successful application of millisecond thermal processing by flash lamp annealing (FLA) as a highly-attractive technique for the functionalization of copper paste screen printed on low-thermal budget paper-like media for package labelling. The effect of the FLA parameters (i.e. pulse duration and energy density), on the substrate behavior as well as on the microstructure and electrical response of the as-flashed films was studied. A significant drop of the sheet resistance of the FL-treated layers as compared to the as-printed layers was observed. As ms-FLA permits selective, near-surface heating, a damage of the sensitive substrates was avoided. The microstructure of the copper paste before and after FLA was also investigated. Being highly-efficient, “non-destructive, and compatible with R2R processing, FLA offers the realization of advanced PFE products.

Keywords: package labeling; flash lamp annealing; millisecond thermal processeing; metal-particle suspension

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Publ.-Id: 22488