X-ray structure characterization of barriers for Cu metallization
X-ray structure characterization of barriers for Cu metallization
Mattern, N.; Hecker, M.; Fischer, D.; Wenzel, C.; Schell, N.; Matz, W.; Engelmann, H.; Zschech, E.
The possibilities and limitations of X-ray scattering techniques are discussed for the structure analysis of Ta-N barriers for Cu metallization.
Keywords: X-ray diffraction; Ta barriers; synchrotron radiation
- Microelectronics Reliability 40(2000) 1765-1770
Permalink: https://www.hzdr.de/publications/Publ-3714
