Pulsed annealing creation of light-emitting Si nanostructures in SiO2 layers implanted with Si ions

Implantation of 100-190 keV Si ions in thin SiO2 layers followed by intense light pulse annealing was used to form Si quantum dots. The ion doses provided the excess Si concentrations of ~10-15%. KrF excimer laser pulses, flash lamp annealing and rapid thermal annealing were used for the post-implantation anneals. The pulse durations were 20ns, 20ms and 1s, respectively. Studies were carried out using photoluminescence excited at 20 oC by a N2 laser. Treatments for 20ns are already sufficient for the segregation of Si and formation of low-dimensional clusters, emitting light in the visible range (400-600 nm). For 20ns pulses no formation of Si-ncs occurs, which is associated with the lack of annealing time. However, if one creates in advance amorphous Si nanoprecipitates, it is possible to form Si-ncs by laser pulses. The crystallization occurs most likely via melting. Formation of the Si-ncs is feasible under the 20ms and 1s light pulses. In this case the temperatures never exceeded Si melting point. Comparison of the Si-ncs formation rate and the estimates of the expected diffusion-limited grain growth yields diffusivity of Si in SiO2 that is much higher, than the values obtained for stationary annealing. Possible mechanism of Si-ncs formation is discussed.