Top-down fabrication of silicon photonic structures for hosting single-photon emitters
Top-down fabrication of silicon photonic structures for hosting single-photon emitters
Jagtap, N.; Hollenbach, M.; Fowley, C.; Berencen, Y.; Lee, W.; Astakhov, G.; Erbe, A.; Helm, M.
Silicon, the ubiquitous material for computer chips, has recently been shown to be instrumental for hosting sources of single-photons emitting in the strategic optical telecommunication O-band (1260-1360 nm)[1], the so-called G center. To increase the brightness and the photon extraction efficiency of single G center, the coupling of these centers into photonic structures is strong. This work presents a top-down approach avoiding the use of ion beam-based etching methods for fabricating high-quality defect-free photonic structures such as silicon nanopillars, which can host singlephoton emitters. This method builds upon a wet-chemical process known as metal-assisted chemical etching. We report the successful fabrication of two-dimensional arrays of vertically-directed waveguiding silicon nanopillars. We also show the etch chemistry dependence on the Si wafer resistivity along with its effect on the etch rate and the sidewall roughness of pillars for a variety of pillar diameters.
References:[1] M. Hollenbach, et al. Opt. Express 28,26111-26121
Involved research facilities
- Ion Beam Center DOI: 10.17815/jlsrf-3-159
Related publications
- DOI: 10.17815/jlsrf-3-159 is cited by this (Id 34549) publication
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virtual DPG-Frühjahrstagungen (DPG Spring Meetings) 2021, 27.-30.09.2021, Online, Germany
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