Structural and Electrical Characterization of Ion Beam Synthesized and n-doped SiC Layers

This work reports preliminary data on the ion beam synthesis of n-doped SiC layers. For this, two approaches have been studied: i) doping by ion implantation (with N) of ion beam synthesized SiC layers and ii) ion beam synthesis of SiC in previously doped (with P) Si wafers. In the first case, the electrical data show a p-type overcompensation of the SiC layer in the range of temperatures between -50°C and 125 °C. The structural (XRD) and in-depth (SIMS; Spreading Resistance) analysis of the samples suggest this overcompensation to be induced by p-type active defects related to the N-ion implantation damage, and therefore the need for further optimization of their thermal processing. In contrast, the p-doped SiC layers always show n-type doping. This is also accompanied by a higher structural quality, being the spectral features of the layers similar to those from the not doped material. Electrical activation of P in the SiC lattice is about one order of magnitude lower than in Si. These data constitute, to our knowledge, the first results reported on the doping of ion beam synthesized SiC layers.