Electrochemical behaviour of bimetallic Ni-Ti surface generated by ion implantation


Electrochemical behaviour of bimetallic Ni-Ti surface generated by ion implantation

Pham, M. T.; Maitz, M. F.; Richter, E.; Reuther, H.; Prokert, F.; Mücklich, A.

Ni was surface-alloyed with Cu, Ti or Cu + Ti by ion implantation. The redox and catalytic activity of the materials was studied in NaOH by cyclic voltammetry. The surface was characterized by X-ray photoelectron spectroscopy, X-ray and electron diffraction, and electron and atomic force microscopy. All three materials exhibited a unique voltammetric response of Ni and were shown to stabilize the ß modification of the Ni oxide/hydroxide. Cu modified the anodic oxidation of glucose and the oxygen evolution to a higher degree than Ti. The morphology and microstructure differed from those of bulk materials.

  • Journal of Materials Science 19(2004)2, 439-446

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