Depth resolved investigations of boron implanted silicon

We have studied the depth distribution and structure of defects in boron implanted silicon (001). Silicon wafers were implanted with a boron dose of 6e15 ions/cm2 at 32 keV and went through different annealing treatments. Using diffuse X-ray scattering at grazing incidence and exit angles we are able to distinguish between different kinds of defects (point defect clusters and extrinsic stacking faults on {111} planes) and to determine their depth distribution as a function of the thermal budget. Cross-section transmission electron microscopy was used to gain complementary information.
In addition we have determined the strain distribution caused by the boron implantation as a function of depth from rocking curve measurements.