Electrochemical behaviour of nickel surface-alloyed with copper and titanium

Ni was surface-alloyed with Cu, Ti or Cu + Ti by ion implantation. This material was examined for its redox and electrocatalytic activity by cyclic voltammetry. The surface was characterized by X-ray photoelectron spectroscopy, X-ray and electron diffraction, and electron and atomic force microscopy. This type of materials exhibited a unique voltammetric response of Ni and was shown to stabilize the ß modification of the Ni oxide/hydroxide. Cu modified the anodic oxidation of glucose and the oxygen evolution to a higher degree than Ti. The morphology and microstructure differed from those of bulk materials.