Ion implantation in silicon: limits of the +1 model


Ion implantation in silicon: limits of the +1 model

Kögler, R.

High energy, high dose Ge ion implantation in silicon results after rapid thermal annealing in a defect structure which shows a stacked structure consisting of sequential layers of vacancy-type defects (cavities) and interstital-type defects (dislocation loops). This structure is in contrast to the predictions of the so called +1 model. The conditions for the formation of such defects and the limits of the +1 model are discussed.

Keywords: Ion implantation; silicon; Ge; +1 model

  • Lecture (Conference)
    43. Arbeitstreffen “Punktdefekte”, 02.-03.03.2005, Dresden, Deutschland

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