Photolithography and Mask Alignment
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For photolithografic patterning of metal, semiconductor or insulator layers like Al, Al/1.5%Si, Au, Cr, Ta, a-Si, a-Ge. SiO2, Si3N4... the following equipment is available:
| Mask-Aligner MA4 (SÜSS) | |
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Substrates
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up to 4" substrates |
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Application
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one- and two-sided photolithographic patterning of metal,
semiconductor or insulator films on semiconductor and glass substrates |
| Mask-Aligner JUB 2104 (ELEKTROMAT) | |
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Substrates
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up to 3" |
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Application
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like MA4 |
| Spin-Coater GYRSET RC 518 (SÜSS) | |
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Substrates
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up to 4" |
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Application
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like GYRSET RC 518 |
| Spin-Coater P6000 (INTEGRATED TECHNOLOGY INC.) | |
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Substrates
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up to 4" |
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Application
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like GYRSET RC 518 |
| XY-dimensions and accuracy of patterned layers can be controlled and measured by optical microscopy combined with a CCD camera and the interactive measuring unit MFK II. | |
