Photolithography and Mask Alignment

 

 

 
 

For photolithografic patterning of metal, semiconductor or insulator layers like Al, Al/1.5%Si, Au, Cr, Ta, a-Si, a-Ge. SiO2, Si3N4... the following equipment is available:

Mask-Aligner MA4 (SÜSS)
Substrates
 
up to 4" substrates
Application
 
one- and two-sided photolithographic patterning of metal, 

semiconductor or insulator films on semiconductor and glass 

substrates

Mask-Aligner JUB 2104 (ELEKTROMAT)
Substrates
 
up to 3"
Application
 
like MA4
Spin-Coater GYRSET RC 518 (SÜSS)
Substrates
 
up to 4"
Application
 
like GYRSET RC 518
Spin-Coater P6000 (INTEGRATED TECHNOLOGY INC.)
Substrates
 
up to 4"
Application
 
like GYRSET RC 518
XY-dimensions and accuracy of patterned layers can be controlled and measured by optical microscopy combined with a CCD camera and the interactive measuring unit MFK II. 

 
 
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