Thin Film Deposition
For thin layer deposition only physical vapour deposition (PVD) techniques with low thermal and radiation substrate stress are used. DC- and RF- high-rate magnetron sputtering, electron beam evaporation and evaporation from thermally heated crucibles are available.
The reactive sputter technique offers the advantage to deposit on substrates compound layers (oxides, oxynitrides, nitrides) from elemental sputter targets by mixing Ar with reactive gases of O2 and/or N2 . Direct sputtering from insulating targets is also possible using the RF-sputtering mode. Heating or cooling of the substrate, bias sputtering and sputter etching also can be applied. The sputter apparatus is equipped with a residual gas analyzer and two optical emission spectrometers to control the residual gas composition and the plasma parameters respectively.
Sputter facility NORDIKO 2000 (NORDIKO Ltd.)
Options | 4 magnetrons (target diameter 200 mm) 2 magnetrons operate in the DC-mode 2 magnetrons operate in the DC- or RF-mode |
Max. Power | PDC =5 kW PRF =2 kW |
Process gasses |
Ar or Ar+7%H2 |
Reactive gasses | O2, N2 |
Substrate/target distance | 55...130 mm |
Max. Substrate diameter | 200 mm |
Substrate thickness | < 25 mm |
Currently used targets | Al(5N), Al(1.5% Si), poly-Si, SiO2/Ge, Ta(3N) for deposition of Al, SiO2, Si- and Ge-rich SiO2-layers, Ta and Ta2O5 |
Operating modes | Automatic mode, manual mode |
Additional equipment |
|
Process monitoring |
|
Wafer load system | Single wafer load lock |
Evaporation facility CREAMET 600 ebeam (Creavac GmbH)
Options |
2 thermal evaporators 1 electron beam evaporator (12 pockets with 4cm³ crucibles) 1 Kaufmann ion source for surface cleaning |
Max. Power |
Pe-gun = 10 kW Pthermal = 2 kW |
Evaporator-substrate distance |
250 mm, 450 mm (designed for lift-off processes) |
Max. Substrate diameter |
100 mm |
Substrate thickness | < 25 mm |
Evaporation materials | Al(5N), Au(5N), Cr, Ni, Ta, Ge, B, … |
Operating modes |
Automatic mode, manual mode |
Process monitoring |
Inficon SQC-310C automated co-deposition controller WARP ebeam evpaorator power supply Beamtek evaporation controller |