Photolithography and mask alignment

Photolithography is the imprint of a pattern into a polymer photoresist in order to leave selected areas of the substrate protected or unprotected for subsequent processing. Spun on layers can have thicknesses from several 10s of nm to several 100s of µm. Lithography It is a critical step in the construction of devices from extended semiconductor or metal films. It is currently one of the most active areas within the cleanroom.

The full suite of lithography tools are available and substrate sizes from 10 x 10 mm² up to 6" wafers can be processed. The patterning of photoresist masks as implantation, etching or lift-off masks is possible via the following equipment:

Mask-Aligner MA6 (SÜSS Microtech)
Substrates	up to 150 mm substrates
Application	one- and two-sided photolithographic patterning of metal, semiconductor or insulator films on semiconductor and glass substrates
Laurell automated spin-coater
Substrates	up to 150 mm substrates
Application	spin coating of acetone disolvable photoresists (S1800, maN1400, maN2400, maP1200)
Spin-Coater APT Polos (SPS Europe B.V.)
Substrates	up to 150 mm subtrates
Application	for non-acetone dissolving resists, like LOL2000, LOR10A and SU8