Contact
Dr. Ahmad Echresh
Cleanroom Manager
Postdoctoral researcher
Nanofabrication and Analysis
a.echresh
hzdr.de
Phone: +49 351 260 3893
Dr. Ciaran Fowley
Head Nanofabrication and Analysis
c.fowleyhzdr.de
Phone: +49 351 260 3253
Photolithography and mask alignment
Photolithography is the imprint of a pattern into a polymer photoresist in order to leave selected areas of the substrate protected or unprotected for subsequent processing. It is a critical step in the construction of devices from extended semiconductor or metal films. It is currently one of the most active areas within the cleanroom.
The full suite of lithography tools are available and substrate sizes from 10 x 10 mm² up to 150 mm wafers can be processed. The patterning of implantation masks as well as metal, semiconductor or insulator layers like Al, Al/1.5%Si, Au, Cr, Ta, a-Si, a-Ge, SiO2, Si3N4, is possible via the following equipment:
| Mask-Aligner MA6 (SÜSS Microtech) | ||
| Substrates | up to 150 mm substrates | |
| Application | one- and two-sided photolithographic patterning of metal, semiconductor or insulator films on semiconductor and glass substrates | |
| Laurell automated spin-coater | ||
| Substrates | up to 150 mm substrates | |
| Application | spin coating of wafers with photoresists (S1800, maN1400, maN2400, maP1200) | |
| Spin-Coater APT Polos (SPS Europe B.V.) | ||
| Substrates | up to 150 mm subtrates | |
| Application | for non-standard resists, like LOL2000, LOR10A and SU8 | |
