Contact

Dr. Gregor Hlawacek

Head Ion Induced Nanostructures
Ion Microscopy
g.hlawacekAthzdr.de
Phone: +49 351 260 3409
+49 351 260 2411

Setups - FWIZ-N

List of our setups for material modification, imaging, analytical methods and preparation.

Modification

Instrument

Functionality

Contact

 

OrsayFIB

OrsayFIB - FWIZ-N instruments ©Copyright: Dr. Klingner, Nico

OrsayFIB - Photo: Nico Klingner

HV-setup for focussed ion beams:

  • LMAIS ion source: < 10 A/cm²
  • kinetic energies: < 30 keV
  • available ion species: Au, Si, Ge, Ga, Co, Nd, Cr, Er, Ni, …
  • local implantations
  • nanostructure preparation by focussed ion beams
  • lateral resolution for Ga ions: 10 nm
  • structure sizes < 50 µm
Nico Klingner
Lothar Bischoff

 

CANION FIB

CANION FIB - FWIZ-N Instruments ©Copyright: Dr. Klingner, Nico

CANION FIB - Photo: Nico Klingner

HV-setup for focussed ion beams:

  • LMAIS ion source: < 10 A/cm²
  • kinetic energies: < 30 keV
  • available ion species: Au, Si, Ge, Ga, Co, Nd, Cr, Er, Ni, …
  • nanostructure preparation by focussed ion beams
  • lateral resolution for Ga ions: 15 nm
  • laser stage for positioning
Lothar Bischoff
Nico Klingner
 

Orion NanoFab

Orion NanoFab - FWIZ-N Instruments ©Copyright: Dr. Hlawacek, Gregor

Orion NanoFab

Photo: Gregor Hlawacek

Helium ion microscope:

  • Backscattering detector for TOF-SIMS
  • Lateral resolution: 0.5 nm (He ions), 1.8 nm (Ne ions)
  • Scanning transmission ion microscopy with position-sensitive detector
  • Imaging with secondary electrons
Gregor Hlawacek
 

NVision 40

NVision 40 - FWIZ-N Instruments ©Copyright: Dr. Bischoff, Lothar

NVision 40 - Photo: Lothar Bischoff

HV-setup for focussed ion and electron beams:

  • nanostructure preparation by focussed Ga ion beams
  • lateral resolution FIB: 7 nm
  • stage range: 100 mm
  • deposition of C and Pt
Lothar Bischoff
 

Orion Plus

Orion Plus - FWIZ-N instruments ©Copyright: Dr. Hlawacek, Gregor

Orion Plus - Photo: Gregor Hlawacek

Helium ion microscope:

  • nanostructure preparation by focussed He or Ne ion beams

  • lateral resolution: He 0.5 nm, Ne 1.6 nm

  • structure sizes ranging from nm to µm

Gregor Hlawacek
 

HCI

HCI - FWIZ-N Instruments ©Copyright: Creutzburg, Sascha

HCI - Photo: Sascha Creutzburg

UHV setup for highly charged ions:

  • available ion species: Ne, Ar, Kr
  • kinetic energy: 0.5q to 4.5q keV
  • Ne, Ar, Kr implantations
René Heller
 

LEI

LEI - FWIZ-N instruments ©Copyright: Singh, Parminder

LEI

Photo: Parminder Singh

HV-setup for low energy ion irradiation:

  • Kaufman-type ion source
  • Noble gas ions with kinetic energies of 200 to 1200 eV
  • Ion induced surface nanopatterning
  • 3 evaporator sources for deposition of metal thin films
  • Polar incidence angles of 0° to 90°
  • Sample heating up to 600°C
Denise Erb

Imaging

Instrument

Functionality

Contact

 

Olympus Ultra Objective

Olympus Ultra Objective - FWIZ-N instruments ©Copyright: Dr. Klingner, Nico

Olympus Ultra Objective

Photo: Nico Klingner

Atomic force microscope:

  • Contact- or tapping-mode AFM
  • Spreading resistance measurements
  • max. scan area: 20 µm x 20 µm
  • optical microscopy
Lothar Bischoff

Gregor Hlawacek

Nico Klingner

 

Bruker Multimode 8 AFM

Bruker Multimode 8 AFM - FWIZ-N Instruments ©Copyright: Singh, Parminder

Bruker Multimode 8 AFM 

Photo: Parminder Singh

Atomic force microscope:

  • Contact- or tapping-mode AFM
  • Spreading resistance measurements (in preparation)
  • 3D topography imaging with 7 nm lateral resolution
  • max. scan area: 15 µm x 15 µm
  • optical microscopy 

 

Denise Erb
 

Omicron UHV AFM / STM

Omicron UHV AFM / STM - FWIZ-N instruments ©Copyright: Singh, Parminder

Omicron UHV AFM / STM

Photo: Parminder Singh

UHV atomic force / scanning transmission microscope:

  • Contact- or non-nontact-mode AFM
  • STM
  • 3D topography imaging with < 1 nm lateral resolution
  • max. scan area: 5 µm x 5 µm
  • sample heating up to 600°C
Stefan Facsko
 

Orion NanoFab

Orion NanoFab - FWIZ-N Instruments ©Copyright: Dr. Hlawacek, Gregor

Orion NanoFab

Photo: Gregor Hlawacek

Helium ion microscope:

  • Backscattering detector for TOF-SIMS
  • Lateral resolution: 0.5 nm (He ions), 1.8 nm (Ne ions)
  • Scanning transmission ion microscopy with position-sensitive detector
  • Imaging with secondary electrons
Gregor Hlawacek
 

Orion Plus

Orion Plus - FWIZ-N instruments ©Copyright: Dr. Hlawacek, Gregor

Orion Plus - Photo: Gregor Hlawacek

Helium ion microscope:

  • Scanning transmission ion microscopy with position-sensitive detector
  • Imaging with secondary electrons
  • Backscattering detector
  • Investigation of non-conductive samples enabled by charge compensation

 

Gregor Hlawacek
 

NVision 40

NVision 40 - FWIZ-N Instruments ©Copyright: Dr. Bischoff, Lothar

NVision 40 - Photo: Lothar Bischoff

HV-setup for focussed ion beams and electron beams:

  • Lateral resolution SEM: 1.5 nm
  • Stage range: 100 mm
Lothar Bischoff
 

NanoSAM

NanoSAM - FWIZ-N Instruments ©Copyright: Dr. Erb, Denise

NanoSAM - Photo: Denise Erb

UHV-setup for electron microscopy:

  • Scanning electron microscopy (SEM)
  • Scanning Auger electron microscopy (SAM)
Denise Erb

Analytics

Instrument

Functionality

Contact

 

TestFIB

TestFIB - FWIZ-N instruments ©Copyright: Dr. Klingner, Nico

TestFIB - Photo: Nico Klingner

UHV-setup for LMAIS (Liquid Metal Alloy Ion Sources) characterization:

  • Mass spectrometry
  • Measurement of source energy distribution
  • Kinetic ion energy < 10 keV
Lothar Bischoff
Nico Klingner
 

NVision 40

NVision 40 - FWIZ-N Instruments ©Copyright: Dr. Bischoff, Lothar

NVision 40 - Photo: Lothar Bischoff

HV-setup for focussed ion beams and electron beams:

  • Energy-dispersive X-ray spectroscopy (EDX)
  • Electron backscattering diffraction (EBSD)
Lothar Bischoff
 

Orion NanoFab

Orion NanoFab - FWIZ-N Instruments ©Copyright: Dr. Hlawacek, Gregor

Orion NanoFab

Photo: Gregor Hlawacek

Helium ion microscope:

  • Backscattering detector for TOF-SIMS
  • Lateral resolution: 0.5 nm (He ions), 1.8 nm (Ne ions)
  • Scanning transmission ion microscopy with position-sensitive detector
  • Imaging with secondary electrons
Gregor Hlawacek
 

HCI

HCI - FWIZ-N Instruments ©Copyright: Creutzburg, Sascha

HCI - Photo: Sascha Creutzburg

UHV setup for highly charged ions:

  • available ion species: Ne, Ar, Kr
  • kinetic energy: 0.5q to 4.5q keV
  • charge states < q = 40 for Ar
  • ion spectroscopy
  • sample temperatures of -200°C to +1000°C
René Heller
 

NanoSAM

NanoSAM - FWIZ-N Instruments ©Copyright: Dr. Erb, Denise

NanoSAM - Photo: Denise Erb

UHV-setup for surface analytics:

  • (Scanning) Auger electron spectroscopy (AES / SAM)
  • X-ray photo-electron spectroscopy (XPS) (in preparation)
  • cathodoluminescence (CL) (in preparation)
  • depth profiling (in preparation)
Denise Erb

Preparation

Instrument

Functionality

Contact

 

Spot Welder

Spot welder - FWIZ-N instruments ©Copyright: Dr. Bischoff, Lothar

Spot welder. Photo: Lothar Bischoff

Spot welding device:

  • Bonding of metal wires and sheets
Lothar Bischoff
Wolfgang Pilz
 

Etching Setup

Etching setup - FWIZ-N Instruments ©Copyright: Dr. Klingner, Nico

Etching setup - Photo: Nico Klingner

Etching setup:

  • Electrochemical etching of tungsten tips for ion sources
Lothar Bischoff
Wolfgang Pilz
Nico Klingner
 

Leica EM TXP

Leica EM TXP - FWIZ-N Instruments ©Copyright: Dr. Klingner, Nico

Leica EM TXP

Photo: Nico Klingner

Mechanical preparation:

  • Milling, sawing, grinding, polishing
  • Preparations for light microscopy and electron microscopy etc.
Nico Klingner
 

ArBlade 5000 CTC

ArBlade - FWIZ-N Instrument ©Copyright: Dr. Klingner, Nico

ArBlade - Photo: Nico Klingner

HV-device for ion beam milling:

  • Unfocussed Ar-beam with kinetic energy of 0.1 to 8 keV
  • Ion milling for surface smoothing/preparation of cross-sections
  • Milling rates of up to 1 mm/hour
Nico Klingner
 

LMAIS Präparation

LMAIS Preparation - FWIZ-N Instruments ©Copyright: Dr. Klingner, Nico

LMAIS Preparation

Photo: Nico Klingner

HV-device for LMAIS (Liquid Metal Alloy Ion Sources)

preparation:

  • Cleaning and melting of alloys
  • Wetting, filling, and functional testing
Lothar Bischoff
Wolfgang Pilz
Nico Klingner