Process Technology and Devices
The Division of Process Technology and Devices performs semiconductor preparation processes for silicon and other semiconductor materials, like GaAs, SiC, Ge and diamond. The activities comprise the pre- and after-ion-beam sample processing, the fabrication of test structures and devices for different analytical and electrical investigations as well as industrial customer based semiconductor process and device development.
The cleanroom assists in enabling the various research topics of the Institute of Ion Beam Physics and Materials Research including Nanostructures, Optoelectronic Materials, Nanomagnetism, Transport in nanostructures and Doping & Defects in Semiconductors. It also assists other research groups both on and off the HZDR campus.
New users, and those who wish to use the cleanroom can do the Cleanroom Introduction online. This is the first step on your journey to using the cleanroom.
Instruction Portal -> Occupational safety -> Repeated briefing -> FWIO - Cleanroom 711/105
Generally all samples processed in the cleanroom are required to have a processing template. This is commonly known as a process flow. These are currently managed through the process approval section of the Nanofaro Wiki.
However, if one only requires short work to be done in the cleanroom you can fill in one of the following forms and bring it to Ciaran Fowley. The processing will then be handled by the cleanroom staff. The forms are also available on the NanoFaRo Wiki under Useful Forms.
- Wet chemistry : For chemistry processes, e.g. Piranha, buffered oxide etching, KOH etching
- Photolithography : For UV lithography with photomasks, otherwise known as microfabrication
- Deposition : Material deposition by evaporation (e-beam and thermal) and sputtering
- Reactive Ion Etching : Reactive ion etching with SF6, CF4, O2 and C4F8
- Thermal Processing : For thermally grown oxides, annealing and rapid themal annealing / processing
Note: the forms are only available internally.
Services and methods:
The preparation equipment in the Class-100 cleanroom incorporates:
- Processing Technologies
- Wet chemical wafer cleaning and isotropic thin layer etching
- Wet chemical anisotropic and selective silicon bulk etching
- Photolithography and mask alignment (double sided) / Direct write laser lithography
- ICP reactive ion etching based on fluorine gases
- Furnace thermal oxidation, diffusion and annealing
- Rapid thermal processing (annealing and oxidation)
- High Temperature vacuum annealing
- Thin Film Deposition
- Sputtering (DC, RF and magnetron, various materials)
- Evaporation (e-beam, resistive, various materials)
- Fine-focused Ion Beam (FIB)
- Direct patterning on µm- and nm-scale
- Local and writing ion implantation
- FIB-assisted layer deposition and etching
- Development and analysis of liquid metal alloy ion sources
- Device Packaging
- Ultrasonic wire bonding
- Adhesive technology
- Measurement and Characterization
- Optical layer thickness measurement (interferometric, ellipsometric)
- Optical line width measurement
- Optical microscopy
- Surface profiling and roughness measurement
- Atomic force microscopy (AFM)
- Electrical measuring techniques (I/V-, MIS-C/V-measurement)
- Computer Aided Design
- Mask layout design for photolithography (AUTOCAD)